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Advances in Modeling and Design of Adhesively Bonded Systems

Advances in Modeling and Design of Adhesively Bonded Systems( )
Editor: Kumar, S.
Mittal, K. L.
Series title:Adhesion and Adhesives: Fundamental and Applied Aspects Ser.
ISBN:978-1-118-68637-9
Publication Date:May 2013
Publisher:John Wiley & Sons, Incorporated
Imprint:Wiley-Scrivener
Book Format:Hardback
List Price:USD $231.95
Book Description:

The book comprehensively charts a way for industry to employ adhesively bonded joints to make systems more efficient and cost-effective

Adhesively bonded systems have found applications in a wide spectrum of industries (e.g. , aerospace, electronics, construction, ship building, biomedical, etc. ) for a variety of purposes.

Book Details
Pages:280
Detailed Subjects: Technology & Engineering / Materials Science / General
Technology & Engineering / Engineering (General)
Physical Dimensions (W X L X H):6.24 x 9.508 x 0.811 Inches
Book Weight:1.1 Pounds



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