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Bonding and Structure
Bonding and Structure
(
)
Editor:
N. Houk, Kendall
Series title:
Topics in Current Chemistry Ser.
ISBN:
978-3-662-15853-1
Publication Date:
Oct 2013
Publisher:
Springer Berlin / Heidelberg
Imprint:
Springer
Book Format:
Paperback
List Price:
USD $54.99
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Book Details
Pages:
204
Detailed Subjects:
Science / Chemistry / General
Science / Physics / Atomic & Molecular
Physical Dimensions
(W X L X H)
:
6.63 x 9.516 x 0.176 Inches
Book Weight:
0.825 Pounds
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