SemiConductor Wafer Bonding Science and Technology |
|
| Author:
| Tong, Q. -Y.
Gösele, U. |
| Series title: | The ECS Series of Texts and Monographs |
| ISBN: | 978-0-471-57481-1 |
| Publication Date: | Dec 1998 |
| Publisher: | John Wiley & Sons, Incorporated
|
| Imprint: | Wiley-Interscience |
| Book Format: | Hardback |
| List Price: | USD $199.95 |
Book Description:
|
Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.
Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.