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The Use of Metal Filled Via Holes for Improving Is... - a book by Ponchak, George E.

The Use of Metal Filled Via Holes for Improving Isolation in Ltcc Rf and Wireless Multichip Packages

The Use of Metal Filled Via Holes for Improving Isolation in Ltcc Rf and Wireless Multichip Packages( )
Author: Ponchak, George E.
Created by: Nasa Technical Reports Server (Ntrs),
Et Al,
ISBN:978-1-289-28503-6
Publication Date:Aug 2013
Publisher:BiblioBazaar
Imprint:BiblioGov
Book Format:Paperback
List Price:USD $17.75
Book Details
Pages:56
Physical Dimensions (W X L X H):7.44 x 9.69 x 0.12 Inches
Book Weight:0.26 Pounds

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