2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
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Author:
| IEEE Staff, |
ISBN: | 978-1-4799-0478-5 |
Publication Date: | Jul 2013 |
Publisher: | IEEE
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Book Format: | USB Flash Drive |
List Price: | USD $290.00 |
Book Description:
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Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and Approaches Novel Device Reliability and Failure Mechanisms Novel Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanisms
Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and Approaches Novel Device Reliability and Failure Mechanisms Novel Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanisms