Search Type
  • All
  • Subject
  • Title
  • Author
  • Publisher
  • Series Title
Search Title

Download

The Use of Metal Filled Via Holes for Improving Isolation in Ltcc Rf and Wireless Multichip Packages

The Use of Metal Filled Via Holes for Improving Isolation in Ltcc Rf and Wireless Multichip Packages( )
Author: Ponchak, George E.
Created by: Nasa Technical Reports Server (Ntrs),
Et Al,
ISBN:978-1-289-28503-6
Publication Date:Aug 2013
Publisher:Creative Media Partners, LLC
Imprint:BiblioGov
Book Format:Paperback
List Price:USD $17.75
Book Details
Pages:56
Physical Dimensions (W X L X H):7.44 x 9.69 x 0.12 Inches
Book Weight:0.26 Pounds



Featured Books

The Velveteen Rabbit
Williams, Margery
Paperback: $9.95
Angels Fall
Roberts, Nora
Paperback: $16.99
American Demon
Stashower, Daniel
Paperback: $20.00

Rate this title:

Select your rating below then click 'submit'.






I do not wish to rate this title.