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Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging( )
Author: Tong, Xingcun Colin
Series title:Springer Series in Advanced Microelectronics Ser.
ISBN:978-1-4614-2792-6
Publication Date:Feb 2013
Publisher:Springer
Book Format:Paperback
List Price:USD $239.00
Book Description:

This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.

Book Details
Pages:618
Detailed Subjects: Technology & Engineering / Industrial Design / Packaging
Technology & Engineering / Electronics / General
Physical Dimensions (W X L X H):6.045 x 9.165 Inches
Book Weight:2.127 Pounds

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