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Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging( )
Author: Tong, Xingcun Colin
Series title:Springer Series in Advanced Microelectronics Ser.
Publication Date:Feb 2013
Book Format:Paperback
List Price:USD $199.99
Book Description:

This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.

Book Details
Detailed Subjects: Technology & Engineering / Industrial Design / Packaging
Technology & Engineering / Electronics / General
Physical Dimensions (W X L X H):6.045 x 9.165 Inches
Book Weight:2.127 Pounds

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