Advanced Materials for Thermal Management of Electronic Packaging |
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| Author:
| Tong, Xingcun Colin |
| Series title: | Springer Series in Advanced Microelectronics Ser. |
| ISBN: | 978-1-4614-2792-6 |
| Publication Date: | Feb 2013 |
| Publisher: | Springer New York
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| Imprint: | Springer |
| Book Format: | Paperback |
| List Price: | USD $279.99 |
Book Description:
|
This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.
This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.