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Lead-Free Solder Composition

United States Patent 9975207

Lead-Free Solder Composition( )
Author: Hwang, Jennie S.
ISBN:979-8-5731-4726-0
Publication Date:Nov 2020
Publisher:Independently Published
Book Format:Paperback
List Price:USD $12.99
Book Description:

A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an...
More Description

Book Details
Pages:24
Physical Dimensions (W X L X H):8.5 x 11 x 0.054 Inches
Book Weight:0.24 Pounds



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