Area Array Packaging Materials Adhesives, Pastes, and Lead-Free |
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| Author:
| Gilleo, Ken |
| ISBN: | 978-0-07-142828-6 |
| Publication Date: | Nov 2003 |
| Publisher: | McGraw-Hill Education (Australia) Pty Limited
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| Book Format: | Hardback |
| List Price: | AUD $285.95 |
Book Description:
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Area array packaging requires particular solder pastes and fluxes. With many countries now requiring that electronic systems be manufactured with lead-free solder, the assembly of high density packages has become more difficult than ever. This engineering reference, written by a team of world class packaging professionals and academics, details cost-effective area array materials options and includes: * Lead-free solder systems * Adhesives and encapsulants * Area array solder pastes...
More DescriptionArea array packaging requires particular solder pastes and fluxes. With many countries now requiring that electronic systems be manufactured with lead-free solder, the assembly of high density packages has become more difficult than ever. This engineering reference, written by a team of world class packaging professionals and academics, details cost-effective area array materials options and includes: * Lead-free solder systems * Adhesives and encapsulants * Area array solder pastes and fluxes * Polymer materials