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Copper Wire Bonding

Copper Wire Bonding( )
Author: Chauhan, Preeti S.
Choubey, Anupam
Zhong, ZhaoWei
Pecht, Michael G.
ISBN:978-1-4614-5760-2
Publication Date:Jul 2013
Publisher:Springer
Book Format:Hardback
List Price:AUD $269.95
Book Description:

Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.

Book Details
Pages:235
Detailed Subjects: Science / Chemistry / Inorganic
Physical Dimensions (W X L X H):15.5 x 23.5 cm
Book Weight:5.207 Kilograms



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