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Copper Wire Bonding

Copper Wire Bonding( )
Author: Chauhan, Preeti S.
Choubey, Anupam
Zhong, ZhaoWei
Pecht, Michael G.
ISBN:978-1-4939-5349-3
Publication Date:Aug 2016
Publisher:Springer
Book Format:Paperback
List Price:AUD $228.95
Book Description:

Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.

Book Details
Pages:235
Detailed Subjects: Science / Chemistry / Inorganic
Physical Dimensions (W X L X H):15.596 x 23.393 x 1.397 cm
Book Weight:4.044 Kilograms



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