Handbook of Semiconductor Manufacturing Technology |
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Contribution by:
| Rizvi, Syed Diebold, Alain C. Dhudshia, Vallabh H. Sun, Ya-Ping Foster, Leonard W. Baumann, Robert Wood, Samuel C. Barna, Gabriel G. Schueler, Bruno W. Havemann, Robert H. Dixit, Girish A. Schroder, Dieter K. Ventzek, Peter L. G. Rauf, Shahid Sparks, Terry G. Hauser, John R. Garza, Cesar M. Timans, Paul J. Meziani, Mohammed J. Pathak, Pankaj Reid, Jonathan D. Lin, Wen Cleavelin, C. Rinn Pas, Sylvia Niimi, Hiroaki Wagner, Lawrence C. Breaux, Louis H. Collins, Sean M. Zhang, Shi-Li Xia, Li-Qun Chang, Mei Hutcheson, G. Dan McKerrow, Andrew J. Tsui, Ting Yiu Lamson, Michael Celler, George K. Fuller, Gene E. Strossman, Greg S. McPherson, Joe Ogawa, Ennis T. Lavoie, Christian Seidel, Thomas E. Madenci, Erdogan |
Editor:
| Nishi, Yoshio Doering, Robert |
ISBN: | 978-1-57444-675-3 |
Publication Date: | Jul 2007 |
Publisher: | CRC Press LLC
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Book Format: | Hardback |
List Price: | AUD $298.99 |
Book Description:
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The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant...
More DescriptionThe second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, damascene copper electroplating, rapid thermal processing, interlevel dielectrics, plasma etch, atomic layer deposition, and more.