| Stress Management for 3D ICS Using Through Silicon Vias International Workshop on Stress Management for 3D ICs Using Through Silicon Vias | | | Editor:
| Zschech, Ehrenfried
Radojcic, Riko
Sukharev, Valeriy
Smith, Larry | | Series title: | AIP Conference Proceedings / Materials Physics and Applications Ser. | | ISBN: | 978-0-7354-0938-5 | | Publication Date: | Jan 2012 | | Publisher: | Springer
| | Imprint: | A I P Press | | Book Format: | Paperback | | List Price: | AUD $261.95 | Book Description:
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