| The Use of Metal Filled Via Holes for Improving Isolation in Ltcc Rf and Wireless Multichip Packages | | | Author:
| Ponchak, George E. | | Created by:
| Nasa Technical Reports Server (Ntrs),
Et Al, | | ISBN: | 978-1-289-28503-6 | | Publication Date: | Aug 2013 | | Publisher: | Creative Media Partners, LLC
| | Imprint: | BiblioGov | | Book Format: | Paperback | | List Price: | AUD $32.99 |
| |