3D-MID: Three-Dimensional Molded Interconnect Devices Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers |
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| Author:
| Frank, Jörg |
| ISBN: | 978-1-56990-551-7 |
| Publication Date: | Apr 2014 |
| Publisher: | Carl Hanser Verlag
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| Book Format: | Hardback |
| List Price: | AUD $199.00 |
Book Description:
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Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.