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Copper Wire Bonding

Copper Wire Bonding( )
Author: Chauhan, Preeti S.
Choubey, Anupam
Zhong, ZhaoWei
Pecht, Michael G.
ISBN:978-1-4614-5760-2
Publication Date:Sep 2013
Publisher:Springer New York
Imprint:Springer
Book Format:Hardback
List Price:USD $139.99
Book Description:

Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.

Book Details
Pages:235
Detailed Subjects: Science / Chemistry / Inorganic
Physical Dimensions (W X L X H):6.045 x 9.165 Inches
Book Weight:11.455 Pounds



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