1997 International Conference on Multichip Modules

(

)

Author:

Editor:

Institute of Electrical and Electronics Engineers, Inc. Staff,

ISBN:

978-0-7803-3787-9

Publication Date:

Apr 1997

Publisher:

IEEE

Book Format:

Paperback

List Price:

Contact Supplier contact

Book Details

Pages:	425
Detailed Subjects:	Technology & Engineering / Electronics / Microelectronics
Physical Dimensions (W X L X H):	8.58 x 10.92 Inches
Book Weight:	2.046 Pounds

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