| 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT2006) | | | Compiled by:
| International Microelectronics and Packaging Society ( IMAPS ) Staff, | | ISBN: | 978-1-60423-620-0 | | Publication Date: | Apr 2007 | | Publisher: | Curran Associates, Incorporated
| | Book Format: | Paperback | | List Price: | USD $250.00 |
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