Advances in System-Integrated Intelligence Proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), September 7-9, 2022, Genova, Italy |
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| Editor:
| Valle, Maurizio
Lehmhus, Dirk
Gianoglio, Christian
Ragusa, Edoardo
Seminara, Lucía
Bosse, Stefan
Ibrahim, Ali
Thoben, Klaus-Dieter |
| Series title: | Lecture Notes in Networks and Systems Ser. |
| ISBN: | 978-3-031-16280-0 |
| Publication Date: | Sep 2022 |
| Publisher: | Springer International Publishing AG
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| Imprint: | Springer |
| Book Format: | Paperback |
| List Price: | USD $159.99USD $109.99 |
Book Description:
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This book reports on cutting-edge research and developments focusing on integrating intelligent functionalities into materials, components, systems and products. Gathering the proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), held on September 7-9, in Genova, Italy, it offers a comprehensive, multidisciplinary and applied perspective on the state-of-the art and challenges in the field of intelligent, flexible and connected...
More DescriptionThis book reports on cutting-edge research and developments focusing on integrating intelligent functionalities into materials, components, systems and products. Gathering the proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), held on September 7-9, in Genova, Italy, it offers a comprehensive, multidisciplinary and applied perspective on the state-of-the art and challenges in the field of intelligent, flexible and connected systems. The book covers advanced methods and applications relating to artificial, pervasive and ubiquitous intelligence, sensors, smart factory and logistics, structural health monitoring, as well as soft robotics, cognitive systems and human-machine interaction. Giving a special focus to artificial intelligence, it extensively reports on methods and algorithms for data-driven modeling, and agent-based data processing and planning. It aims at inspiring and fostering collaboration between researchers and professionals from the different fields of electrical, manufacturing and production engineering, and materials and computer sciences.