Bonding in Microsystem Technology |
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| Author:
| Dziuban, Jan A. |
| Series title: | Springer Series in Advanced Microelectronics Ser. |
| ISBN: | 978-1-4020-4578-3 |
| Publication Date: | Jun 2006 |
| Publisher: | Springer Netherlands
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| Imprint: | Springer |
| Book Format: | Hardback |
| List Price: | USD $169.99 |
Book Description:
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This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.