Chemical-Mechanical Polishing 2000 Fundamentals and Materials Issues |
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| Editor:
| Singh, Rajiv K.
Bajaj, Rajeev
Moinpour, Mansour
Meuris, Marc |
| Series title: | MRS Proceedings Ser. |
| ISBN: | 978-1-107-41314-6 |
| Publication Date: | Jun 2014 |
| Publisher: | Cambridge University Press
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| Book Format: | Paperback |
| List Price: | USD $34.99 |
Book Description:
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Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.