| Development of Aluminum, Manganese, and Zinc-Doped Tin-Silver-Copper-X Solders for Electronic Assembly | | | Author:
| Boesenberg, Adam James | | ISBN: | 978-1-249-08268-2 | | Publication Date: | Jul 2012 | | Publisher: | Creative Media Partners, LLC
| | Imprint: | Proquest, UMI Dissertation Publishing | | Book Format: | Paperback | | List Price: | USD $69.00 |
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