Electronic Packaging Interconnect Technology |
|
| Editor:
| Nogita, Kazuhiro
Mohd Salleh, Mohd Arif Anuar
Abdullah, Mohd Mustafa Al Bakri
Jamaludin, Liyana
Mohd Tahir, Muhammad Faheem |
| ISBN: | 978-3-0357-3324-2 |
| Publication Date: | Apr 2018 |
| Publisher: | Trans Tech Publications, Limited
|
| Book Format: | Digital download and online |
| List Price: | USD $170.00USD $187.00 |
Book Description:
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Electronic Packaging Interconnect Technology Symposium (EPITS 2017)Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
Electronic Packaging Interconnect Technology Symposium (EPITS 2017)Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan