Enabling Technologies for 3-D Integration Symposium Held November 27-29, 2006, Boston, Massachusetts, U. S. A |
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| Editor:
| Bower, Christopher Andrew
Garrou, Philip E.
Ramm, Peter
Takahashi, Kenji |
| Contribution by:
| Materials Research Society, Meeting Staff, |
| Series title: | MRS Proceedings Ser. |
| ISBN: | 978-1-55899-927-5 |
| Publication Date: | Mar 2007 |
| Publisher: | Cambridge University Press
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| Book Format: | Hardback |
| List Price: | USD $37.99 |
Book Description:
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An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; and applications of 3-D integration.
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; and applications of 3-D integration.