Handbook of Semiconductor Manufacturing Technology |
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| Contribution by:
| Rizvi, Syed
Diebold, Alain C.
Dhudshia, Vallabh H.
Sun, Ya-Ping
Foster, Leonard W.
Baumann, Robert
Wood, Samuel C.
Barna, Gabriel G.
Schueler, Bruno W.
Havemann, Robert H.
Dixit, Girish A.
Schroder, Dieter K.
Ventzek, Peter L. G.
Rauf, Shahid
Sparks, Terry G.
Hauser, John R.
Garza, Cesar M.
Timans, Paul J.
Meziani, Mohammed J.
Pathak, Pankaj
Reid, Jonathan D.
Lin, Wen
Cleavelin, C. Rinn
Pas, Sylvia
Niimi, Hiroaki
Wagner, Lawrence C.
Breaux, Louis H.
Collins, Sean M.
Zhang, Shi-Li
Xia, Li-Qun
Chang, Mei
Hutcheson, G. Dan
McKerrow, Andrew J.
Tsui, Ting Yiu
Lamson, Michael
Celler, George K.
Fuller, Gene E.
Strossman, Greg S.
McPherson, Joe
Ogawa, Ennis T.
Lavoie, Christian
Seidel, Thomas E.
Madenci, Erdogan |
| Editor:
| Nishi, Yoshio
Doering, Robert |
| ISBN: | 978-1-57444-675-3 |
| Publication Date: | Jul 2007 |
| Publisher: | CRC Press LLC
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| Book Format: | Hardback |
| List Price: | USD $260.00USD $209.95USD $315.00 |
Book Description:
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The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant...
More DescriptionThe second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, damascene copper electroplating, rapid thermal processing, interlevel dielectrics, plasma etch, atomic layer deposition, and more.