Hybrid Systems-In-Foil |
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| Author:
| Elsobky, Mourad
Burghartz, Joachim N. |
| Series title: | Elements in Flexible and Large-Area Electronics Ser. |
| ISBN: | 978-1-108-98474-4 |
| Publication Date: | Oct 2021 |
| Publisher: | Cambridge University Press
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| Book Format: | Paperback |
| List Price: | USD $22.00 |
Book Description:
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An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable electronic components are presented demonstrating the benefits of HySiF, and prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable electronic components are presented demonstrating the benefits of HySiF, and prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.