Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics - 2009 |
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| Editor:
| Gall, M.
Grill, A.
Lacopi, F.
Koike, Junichi
Usui, T. |
| Series title: | MRS Proceedings Ser. |
| ISBN: | 978-1-60511-129-2 |
| Publication Date: | Nov 2009 |
| Publisher: | Cambridge University Press
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| Book Format: | Hardback |
| List Price: | USD $119.00 |
Book Description:
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This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.