| Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects | | | Editor:
| Tsui, T. Y.
Joo, Y-C
Volinsky, A. A.
Lane, M.
Michaelson, L. W. | | Series title: | Symposium Proceedings Ser. | | ISBN: | 978-1-55899-870-4 | | Publisher: | Materials Research Society
| | Book Format: | Hardback | | List Price: | USD $114.00 |
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