| Novel Conductive Adhesives for Electronic Packaging Applications A Way Towards Economical, Highly Conductive, Low Temperature and Flexible Interconne | | | Author:
| Zhang, Rongwei | | ISBN: | 978-1-249-04644-8 | | Publication Date: | Jul 2012 | | Publisher: | Creative Media Partners, LLC
| | Imprint: | Proquest, UMI Dissertation Publishing | | Book Format: | Paperback | | List Price: | USD $69.00 |
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