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Pick-up Process Analysis of a Die Bonder

Pick-up Process Analysis of a Die Bonder( )
Author: Lin, Yeong-Jyh
Hwang, Sheng-Jye
ISBN:978-3-639-00034-4
Publication Date:Apr 2008
Publisher:AV Akademikerverlag GmbH & Co. KG
Book Format:Paperback
List Price:USD $76.00
Book Details
Pages:136
Detailed Subjects: Design / Graphic Arts / Typography
Physical Dimensions (W X L X H):6 x 9 x 0.29 Inches
Book Weight:0.47 Pounds



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