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Pick-up Process Analysis of a Die Bonder
Pick-up Process Analysis of a Die Bonder
(
)
Author:
Lin, Yeong-Jyh
Hwang, Sheng-Jye
ISBN:
978-3-639-00034-4
Publication Date:
Apr 2008
Publisher:
AV Akademikerverlag GmbH & Co. KG
Book Format:
Paperback
List Price:
USD $76.00
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Book Details
Pages:
136
Detailed Subjects:
Design / Graphic Arts / Typography
Physical Dimensions
(W X L X H)
:
6 x 9 x 0.29 Inches
Book Weight:
0.47 Pounds
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