Quality Conformance and Qualification of Microelectronic Packages and Interconnects |
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| Editor:
| Pecht, Michael
Dasgupta, Abhijit
Evans, John W.
Evans, Jillian Y. |
| ISBN: | 978-0-471-59436-9 |
| Publication Date: | Dec 1994 |
| Publisher: | John Wiley & Sons, Incorporated
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| Imprint: | Wiley-Interscience |
| Book Format: | Paperback |
| List Price: | USD $188.95 |
Book Description:
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All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted.
All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted.