Three-Dimensional Integrated Circuit Design |
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| Author:
| Pavlidis, Vasilis F.
Savidis, Ioannis
Friedman, Eby G. |
| ISBN: | 978-0-12-410501-0 |
| Publication Date: | Jul 2017 |
| Publisher: | Elsevier Science & Technology
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| Imprint: | Morgan Kaufmann |
| Book Format: | Paperback |
| List Price: | USD $99.95 |
Book Description:
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase...
More Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits.
Expanded with new chapters and updates throughout based on the latest research in 3-D integration:
- Manufacturing techniques for 3-D ICs with TSVs
- Electrical modeling and closed-form expressions of through silicon vias
- Substrate noise coupling in heterogeneous 3-D ICs
- Design of 3-D ICs with inductive links
- Synchronization in 3-D ICs
- Variation effects on 3-D ICs
- Correlation of WID variations for intra-tier buffers and wires