ULSI Process Integration 5 ECS Transactions: Volume 11, Issue 6 |
|
| Editor:
| Claeys, C.
Iwai, H.
Tao, M.
Murota, J.
Liou, Juin J.
Deleonibus, S. |
| ISBN: | 978-1-56677-572-4 |
| Publication Date: | Sep 2007 |
| Publisher: | Electrochemical Society, The
|
| Imprint: | ECS Transactions |
| Book Format: | Hardback |
| List Price: | USD $103.00 |
Book Description:
|
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain...
More DescriptionThe symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.