VLSI-SoC: Design Trends 28th IFIP WG 10. 5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised Selected Papers |
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| Editor:
| Calimera, Andrea
Gaillardon, Pierre-Emmanuel
Korgaonkar, Kunal
Kvatinsky, Shahar
Reis, Ricardo |
| Series title: | IFIP Advances in Information and Communication Technology Ser. |
| ISBN: | 978-3-030-81640-7 |
| Publication Date: | Jul 2021 |
| Publisher: | Springer International Publishing AG
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| Imprint: | Springer |
| Book Format: | Hardback |
| List Price: | USD $149.99USD $139.99 |
Book Description:
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This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*
The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends...
More Description
This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*
The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.
*The conference was held virtually.