Advanced MEMS Packaging

(

)

Author:

Lau, John H.
Lee, Cheng Kuo
Premachandran, C. S.
Aibin, Yu

ISBN:

978-0-07-162623-1

Publication Date:

Nov 2009

Publisher:

McGraw-Hill Education

Book Format:

Hardback

List Price:

USD $179.00

Book Description:

This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.

Book Details

Pages:	576
Detailed Subjects:	Technology & Engineering / Nanotechnology & Mems Technology & Engineering / Industrial Design / Packaging
Physical Dimensions (W X L X H):	6.341 x 9.212 x 1.357 Inches
Book Weight:	2.064 Pounds

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