John H Lau

John H Lau is the author of "Semiconductor Advanced Packaging", "Advanced MEMS Packaging", "Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology" and "Assembly and Reliability of Lead-Free Solder Joints".

Books by John H Lau

Chip on Board
Lau, John H.
Hardback: $219.99

Reliability of Ro...
Lau, John H.
Electronic book text: $125.00

Reliability of Ro...
Lau, John H.
Hardback: $161.00

Advanced MEMS Pac...
Lau, John H.
Hardback: $179.00