Reliability of Rohs-Compliant 2D and 3D IC Interconnects |
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| Author:
| Lau, John H. |
| Series title: | Electronic Engineering Ser. |
| ISBN: | 978-1-282-95336-9 |
| Publication Date: | Jan 2010 |
| Publisher: | McGraw-Hill Professional Publishing
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| Book Format: | Ebook |
| List Price: | USD $125.00 |
Book Description:
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Proven 2D and 3D IC lead-free interconnect reliability techniques
"Reliability of RoHS-Compliant 2D and 3D IC Interconnects" offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level...
More Description
Proven 2D and 3D IC lead-free interconnect reliability techniques
"Reliability of RoHS-Compliant 2D and 3D IC Interconnects" offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of: 2D and 3D IC lead-free interconnectsCCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder jointsLead-free (SACX) solder jointsLow-temperature lead-free (SnBiAg) solder jointsSolder joints with voids, high strain rate, and high ramp rateVCSEL and LED lead-free interconnects3D LED and 3D MEMS with TSVsChip-to-wafer (C2W) bonding and lead-free interconnectsWafer-to-wafer (W2W) bonding and lead-free interconnects3D IC chip stacking with low-temperature bondingTSV interposers and lead-free interconnectsElectromigration of lead-free microbumps for 3D IC integration