tzyy-sheng

Displaying 1- 8 of 8 results for keyword "tzyy-sheng" books

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1.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28965-4 Book Format: Digital online List Price: USD $166.95 Publisher: John Wiley & Sons, Incorporated Publication Date: Mar 2018 Quantity Note

2.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28967-8 Book Format: Digital download List Price: Contact Supplier contact Contact Supplier contact Publisher: John Wiley & Sons, Incorporated Publication Date: Mar 2018 Quantity Note

3.		Principles and Applications of RF/Microwave in Healthcare and Biosensing Author: Li, Changzhi Tofighi, Mohammad-Reza Schreurs, Dominique Horng, Tzyy-Sheng Jason ISBN: 978-0-12-809218-7 Book Format: Ebook List Price: USD $155.00USD $186.00 Publisher: Elsevier Science & Technology Books Publication Date: Oct 2016 Quantity Note

4.		Principles and Applications of RF/Microwave in Healthcare and Biosensing Author: Li, Changzhi Tofighi, Mohammad-Reza Schreurs, Dominique Horng, Tzyy-Sheng Jason ISBN: 978-0-12-802903-9 Book Format: Hardback List Price: USD $155.00 Publisher: Elsevier Science & Technology Publication Date: Nov 2016 Quantity Note

5.		Principles and Applications of RF/Microwave in Healthcare and Biosensing Author: Li, Changzhi Tofighi, Mohammad-Reza Schreurs, Dominique Horng, Tzyy-Sheng Jason ISBN: 978-0-12-802903-9 Book Format: Hardback List Price: AUD $182.95 Publisher: Elsevier Science & Technology Books Publication Date: Oct 2016 Quantity Note

6.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28966-1 Book Format: Digital download List Price: Contact Supplier contact Contact Supplier contact Publisher: John Wiley & Sons, Incorporated Publication Date: Mar 2018 Quantity Note

7.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28964-7 Book Format: Hardback List Price: USD $166.95 Publisher: John Wiley & Sons, Incorporated Publication Date: Jul 2018 Quantity Note

8.		3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility Author: Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason ISBN: 978-1-119-28964-7 Book Format: Hardback List Price: AUD $223.95 Publisher: John Wiley & Sons, Incorporated Publication Date: Apr 2018 Quantity Note