Books By Lau, John H.

1.

Semiconductor Advanced Packaging

Author:: Lau, John H.

ISBN:: 978-981-16-1375-3

Book Format:: Hardback

List Price:: USD $179.99

Publisher:: Springer

Publication Date:: May 2021

2.

Advanced MEMS Packaging

Author:: Lau, John H.
Lee, Cheng Kuo
Premachandran, C. S.
Aibin, Yu

ISBN:: 978-0-07-162623-1

Book Format:: Hardback

List Price:: USD $179.00

Publisher:: McGraw-Hill Education

Publication Date:: Nov 2009

3.

Electronic Packaging: Design, Materials, Process, ... - a book by Lau, John H.

Electronic Packaging: Design, Materials, Process, and Reliability

Author:: Lau, John H.
Nakayama, Wataru
Prince, John
Wong, C. P.

ISBN:: 978-0-07-037135-4

Book Format:: Hardback

List Price:: AUD $182.95

Publisher:: McGraw-Hill Education (Australia) Pty Limited

Publication Date:: Feb 1998

4.

Solder Joint Reliability of BGA, CSP, Flip Chip, a... - a book by Lau, John H.

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Author:: Lau, John H.
Pao, Yi-Hsin

ISBN:: 978-0-07-036648-0

Book Format:: Hardback

List Price:: AUD $188.95

Publisher:: McGraw-Hill Professional Publishing

Publication Date:: Aug 1996

5.

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Tec... - a book by Lau, John H.

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Author:: Lau, John H.

ISBN:: 978-981-97-2139-9

Book Format:: Hardback

List Price:: USD $199.99

Publisher:: Springer

Publication Date:: Jul 2024

6.

Assembly and Reliability of Lead-Free Solder Joint... - a book by Lau, John H.

Assembly and Reliability of Lead-Free Solder Joints

Author:: Lau, John H.
Lee, Ning-Cheng

ISBN:: 978-981-15-3922-0

Book Format:: Paperback

List Price:: USD $129.99

Publisher:: Springer

Publication Date:: May 2021

7.

Reliability of RoHS-Compliant 2D and 3D IC Interco... - a book by Lau, John H.

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Author:: Lau, John H.

ISBN:: 978-0-07-175379-1

Book Format:: Hardback

List Price:: USD $161.00

Publisher:: McGraw-Hill Education

Publication Date:: Dec 2010

8.

Microvias

For Low Cost, High Density Interconnects

Author:: Lau, John H.
Lee, S. W. Ricky

ISBN:: 978-0-07-138299-1

Book Format:: Ebook

List Price:: USD $89.95

Publisher:: McGraw-Hill Professional Publishing

Publication Date:: Apr 2001

9.

Chip Scale Package, Csp

Author:: Lau, John H.
Lee, Ricky S. W.

ISBN:: 978-0-07-038304-3

Book Format:: Hardback

List Price:: USD $89.50

Publisher:: McGraw-Hill Professional Publishing

Publication Date:: Feb 1999

10.

Chip on Board

Technology for Multichip Modules

Author:: Lau, John H.

ISBN:: 978-0-442-01441-4

Book Format:: Hardback

List Price:: AUD $471.95

Publisher:: Springer London, Limited

Publication Date:: Jun 1994

11.

Reliability of Rohs-Compliant 2D and 3D IC Interconnects

Author:: Lau, John H.

ISBN:: 978-1-282-95336-9

Book Format:: Ebook

List Price:: USD $125.00

Publisher:: McGraw-Hill Professional Publishing

Publication Date:: Jan 2010

12.

Low Cost Flip Chip Technologies for DCA, WLCSP, an... - a book by Lau, John H.

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Author:: Lau, John H.

ISBN:: 978-0-07-135141-6

Book Format:: Hardback

List Price:: AUD $207.95

Publisher:: McGraw-Hill Education (Australia) Pty Limited

Publication Date:: Feb 2000

13.

3D IC Integration and Packaging

Author:: Lau, John H.

ISBN:: 978-0-07-184806-0

Book Format:: Hardback

List Price:: AUD $340.95

Publisher:: McGraw-Hill Education (Australia) Pty Limited

Publication Date:: Aug 2015

14.

Through-Silicon Vias for 3D Integration

Author:: Lau, John H.

ISBN:: 978-0-07-178514-3

Book Format:: Hardback

List Price:: AUD $279.95

Publisher:: McGraw-Hill Education (Australia) Pty Limited

Publication Date:: Sep 2012

15.

Electronics Manufacturing

With Lead-Free, Halogen-Free, and...

Author:: Lau, John H.
Wong, C. P.
Lee, Ning-Cheng
Lee, Ricky S. W.

ISBN:: 978-0-07-138624-1

Book Format:: Hardback

List Price:: USD $162.00

Publisher:: McGraw-Hill Education

Publication Date:: Sep 2002

16.

Microvias: for Low Cost, High Density Interconnect... - a book by Lau, John H.

Microvias: for Low Cost, High Density Interconnects

Author:: Lau, John H.
Lee, Ricky S. W.

ISBN:: 978-0-07-136327-3

Book Format:: Hardback

List Price:: AUD $224.95

Publisher:: McGraw-Hill Education (Australia) Pty Limited

Publication Date:: May 2001

17.

3D IC Integration and Packaging

Author:: Lau, John H.

ISBN:: 978-0-07-184806-0

Book Format:: Hardback

List Price:: USD $218.00

Publisher:: McGraw-Hill Education

Publication Date:: Aug 2015

18.

Advanced Mems Packaging

Author:: Lau, John H.
Lee, Cheng Kuo
Premachandran, C. S.
Aibin, Yu

ISBN:: 978-1-282-34380-1

Book Format:: Ebook

List Price:: USD $150.00

Publisher:: McGraw-Hill Companies, The

Publication Date:: Jan 2009

19.

Electronics Manufacturing

With Lead-Free, Halogen-Free, and...

Author:: Lau, John H.
Wong, C. P.
Lee, Ning-Cheng
Lee, Ricky S. W.

ISBN:: 978-0-07-138624-1

Book Format:: Hardback

List Price:: Contact Supplier contact

Publisher:: McGraw-Hill Education (Australia) Pty Limited

Publication Date:: Aug 2002

20.

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Author:: Lau, John H.

ISBN:: 978-0-07-175379-1

Book Format:: Hardback

List Price:: AUD $251.95

Publisher:: McGraw-Hill Education (Australia) Pty Limited

Publication Date:: Dec 2010

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1.		Semiconductor Advanced Packaging Author: Lau, John H. ISBN: 978-981-16-1375-3 Book Format: Hardback List Price: USD $179.99 Publisher: Springer Publication Date: May 2021 Quantity Note

2.		Advanced MEMS Packaging Author: Lau, John H. Lee, Cheng Kuo Premachandran, C. S. Aibin, Yu ISBN: 978-0-07-162623-1 Book Format: Hardback List Price: USD $179.00 Publisher: McGraw-Hill Education Publication Date: Nov 2009 Quantity Note

3.		Electronic Packaging: Design, Materials, Process, and Reliability Author: Lau, John H. Nakayama, Wataru Prince, John Wong, C. P. ISBN: 978-0-07-037135-4 Book Format: Hardback List Price: AUD $182.95 Publisher: McGraw-Hill Education (Australia) Pty Limited Publication Date: Feb 1998 Quantity Note

4.		Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies Author: Lau, John H. Pao, Yi-Hsin ISBN: 978-0-07-036648-0 Book Format: Hardback List Price: AUD $188.95 Publisher: McGraw-Hill Professional Publishing Publication Date: Aug 1996 Quantity Note

5.		Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology Author: Lau, John H. ISBN: 978-981-97-2139-9 Book Format: Hardback List Price: USD $199.99 Publisher: Springer Publication Date: Jul 2024 Quantity Note

6.		Assembly and Reliability of Lead-Free Solder Joints Author: Lau, John H. Lee, Ning-Cheng ISBN: 978-981-15-3922-0 Book Format: Paperback List Price: USD $129.99 Publisher: Springer Publication Date: May 2021 Quantity Note

7.		Reliability of RoHS-Compliant 2D and 3D IC Interconnects Author: Lau, John H. ISBN: 978-0-07-175379-1 Book Format: Hardback List Price: USD $161.00 Publisher: McGraw-Hill Education Publication Date: Dec 2010 Quantity Note

8.		Microvias For Low Cost, High Density Interconnects Author: Lau, John H. Lee, S. W. Ricky ISBN: 978-0-07-138299-1 Book Format: Ebook List Price: USD $89.95 Publisher: McGraw-Hill Professional Publishing Publication Date: Apr 2001 Quantity Note

9.		Chip Scale Package, Csp Author: Lau, John H. Lee, Ricky S. W. ISBN: 978-0-07-038304-3 Book Format: Hardback List Price: USD $89.50 Publisher: McGraw-Hill Professional Publishing Publication Date: Feb 1999 Quantity Note

10.		Chip on Board Technology for Multichip Modules Author: Lau, John H. ISBN: 978-0-442-01441-4 Book Format: Hardback List Price: AUD $471.95 Publisher: Springer London, Limited Publication Date: Jun 1994 Quantity Note

11.		Reliability of Rohs-Compliant 2D and 3D IC Interconnects Author: Lau, John H. ISBN: 978-1-282-95336-9 Book Format: Ebook List Price: USD $125.00 Publisher: McGraw-Hill Professional Publishing Publication Date: Jan 2010 Quantity Note

12.		Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies Author: Lau, John H. ISBN: 978-0-07-135141-6 Book Format: Hardback List Price: AUD $207.95 Publisher: McGraw-Hill Education (Australia) Pty Limited Publication Date: Feb 2000 Quantity Note

13.		3D IC Integration and Packaging Author: Lau, John H. ISBN: 978-0-07-184806-0 Book Format: Hardback List Price: AUD $340.95 Publisher: McGraw-Hill Education (Australia) Pty Limited Publication Date: Aug 2015 Quantity Note

14.		Through-Silicon Vias for 3D Integration Author: Lau, John H. ISBN: 978-0-07-178514-3 Book Format: Hardback List Price: AUD $279.95 Publisher: McGraw-Hill Education (Australia) Pty Limited Publication Date: Sep 2012 Quantity Note

15.		Electronics Manufacturing With Lead-Free, Halogen-Free, and... Author: Lau, John H. Wong, C. P. Lee, Ning-Cheng Lee, Ricky S. W. ISBN: 978-0-07-138624-1 Book Format: Hardback List Price: USD $162.00 Publisher: McGraw-Hill Education Publication Date: Sep 2002 Quantity Note

16.		Microvias: for Low Cost, High Density Interconnects Author: Lau, John H. Lee, Ricky S. W. ISBN: 978-0-07-136327-3 Book Format: Hardback List Price: AUD $224.95 Publisher: McGraw-Hill Education (Australia) Pty Limited Publication Date: May 2001 Quantity Note

17.		3D IC Integration and Packaging Author: Lau, John H. ISBN: 978-0-07-184806-0 Book Format: Hardback List Price: USD $218.00 Publisher: McGraw-Hill Education Publication Date: Aug 2015 Quantity Note

18.		Advanced Mems Packaging Author: Lau, John H. Lee, Cheng Kuo Premachandran, C. S. Aibin, Yu ISBN: 978-1-282-34380-1 Book Format: Ebook List Price: USD $150.00 Publisher: McGraw-Hill Companies, The Publication Date: Jan 2009 Quantity Note

19.		Electronics Manufacturing With Lead-Free, Halogen-Free, and... Author: Lau, John H. Wong, C. P. Lee, Ning-Cheng Lee, Ricky S. W. ISBN: 978-0-07-138624-1 Book Format: Hardback List Price: Contact Supplier contact Publisher: McGraw-Hill Education (Australia) Pty Limited Publication Date: Aug 2002 Quantity Note

20.		Reliability of RoHS-Compliant 2D and 3D IC Interconnects Author: Lau, John H. ISBN: 978-0-07-175379-1 Book Format: Hardback List Price: AUD $251.95 Publisher: McGraw-Hill Education (Australia) Pty Limited Publication Date: Dec 2010 Quantity Note